3D IC to bring business opportunities for Taiwan semiconductor equipment makersPatty Wang, Taipei; Adam Hwang, DIGITIMES [Wednesday 20 June 2012]3D IC is expected to afford business opportunities for Taiwan-based makers of semiconductor production equipment because processes and corresponding equipment for 3D ICs have not yet been standardized and therefore Taiwan-based makers can cooperate with foundry services providers in R&D for 3D IC equipment, according to chairman Hsu Chin-jung for Taiwan-based Hermes Microvision a maker of E(electronic)-beam inspection systems.International vendors, including KLA, ASML, Applied Materials and Tokyo Electron, have dominated the supply of semiconductor equipment in Taiwan, with Taiwan-based makers occupying only 10% of the market, Hsu noted. For 3D IC however, Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are engaging in R&D to develop specifications for processes and equipment and are expected to seek cooperation with Taiwan-based equipment makers, Hsu said.As demand for 3D IC is expected to take off in 3-5 years, Hermes Microvision has begun evaluating the feasibility of producing E-beam inspection systems for use in 3D IC, Hsu said. Hermes Microvision currently has a global market share of 85% for E-beam inspection systems, with clients including TSMC, UMC, Intel, Samsung Electronics and Toshiba, Hsu indicated.Balance in solar market to return in 2014-2015, says SAS chairmanGreen energy | 1h 24min agoLenovo reportedly to launch dual-screen notebook similar to Asustek TaichiIT + CE | 1h 27min agoTianma 4.5G LTPS experimental line begins trial operationsDisplays | 1h 31min agoIntel aggressively planning for the smartphone industryMobile + telecom | 1h 33min agoCsun, Chroma eyeing LED equipment marketLED | 1h 55min agoViking Tech expects heat dissipation substrate revenues in 2H12 to show growthBits + chips | 2h 26min agoIntel to host supply chain conference to help boost ultrabook demandIT + CE | 2h 35min agoTaiwan May export order value up on month, down on yearBits + chips | 4h 6min agoBranded handset vendors cutting orders to component suppliers, say sourcesBefore Going to Press | 2h 11min agoFormosa Epitaxy sees order visibility extend to November Before Going to Press | 2h 29min agoCPT to roll out OGS touch panels in OctoberBefore Going to Press | 2h 50min agoAnalog IC revenues to show sequential increase of 5-20%, 3Q12Before Going to Press | 3h 27min agoSilitech looks to strong sales in 3Q12Before Going to Press | 3h 28min agoASE, SPIL to expand capacity in 2012 despite market oversupplyBefore Going to Press | 3h 31min agoDRAM industry faces uncertainties in 3Q12Before Going to Press | 4h agoSolartech likely to return to profitability in June, says chairmanBefore Going to Press | 4h 24min ago
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